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NANOC - Nanoscale Silicon-Aware Network-on-Chip Design Platform

  • 21304
  • CORDIS - PROJECTS 12/01/2010
  • RISULTATO

The NaNoC project aims at developing an innovative design platform for future Network-on-Chip (NoC) based multi-core systems. This NaNoC design platform intends to master the design complexity of advanced microelectronic systems by enabling strict component oriented architectural design. A compositional approach to NoC design in future multi-core chips is out of the reach of current design methods and tools due to new design constraints.
Requirements for co-design with high-level platform management frameworks facilitates a need for enhanced dynamism and flexibility in NoC composition (e.g., virtualization, power management, thermal management, application management). On the other hand, a higher degree of uncertainty originating from nanoscale IC fabrication technologies raises the need to build reliable systems out of unreliable components. The NaNoC design platform provides design methods and prototype tools to cope with both challenges and to make NoCs a mainstream interconnect backbone for effective system integration. The platform enables NoC component assembly at each layer of the design hierarchy. Therefore, design for manufacturability techniques and tools are developed to preserve yield in the presence of manufacturing defects and circuit performance/power variability.
Above all, the NaNoC design platform fosters the tight cooperation between system research, circuit design and process development by means of a silicon-aware decision making at each layer of the design hierarchy. In this direction, NaNoC not only provides a cross-layer approach to tackle composability challenges (e.g., physical design techniques for enhanced reliability combined with architecture-level techniques for fault containment), but also defines an exchange format for interoperability between design tools for cross-layer optimization. Interoperability between developed NoC design methods/prototype tools and mainstream design toolflows will also be pursued.


Start date: 2010-01-01
End date: 2012-12-31

Duration: 36 months

Project Reference: 248972

Project cost: 4.21 million euro
Project Funding: 2.92 million euro

Subprogramme Area: ICT-2009.3.2 Design of semiconductor components and electronic based miniaturised systems
Contract type: No contract type



Coordinatore: UNIVERSIDAD POLITECNICA DE VALENCIA - Jose Antonio PEREZ GARCIA

Altri Partecipanti

  • INFINEON TECHNOLOGIES AG - GERMANY
  • TEKLATECH AS - DENMARK
  • SIMULA RESEARCH LABORATORY AS - NORWAY
  • UNIVERSITA DEGLI STUDI DI FERRARA - ITALY
  • INOCS - SWITZERLAND
Link
Quadro di finanziamento
  • 7FP-ICT : TECNOLOGIE DELL’INFORMAZIONE E DELLA COMUNICAZIONE: priorità tematica 3 nell'ambito del programma specifico “Cooperazione” recante attuazione del Settimo programma quadro (2007-2013) di attività comunitarie di ricerca, sviluppo tecnologico e dimostrazione
Area di interesse
  • Unione Europea