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THERMINATOR - Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future

  • 22191
  • CORDIS - PROJECTS 13/05/2010
  • RISULTATO

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and device breakdown. To complicate the picture, electronic components tend to get warmer on their own as they operate, due to the fact that the power drawn by the devices from the power supply is dissipated by Joule effect.

As time passes, heat and temperature management is becoming increasingly problematic, for reasons ranging from economical to technological. Packages that are able to sustain high temperatures are very expensive, and so are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause malfunctioning of circuits and components, thus impacting the reliability of the electronic products which incorporate such devices. The development of new, thermal-aware design paradigms can no longer be postponed if the goal is to enable designers to fully exploit the electronic technologies of the future, being those CMOS or alternative to CMOS. The thermal problem has several facets, thus it needs to be addressed in a comprehensive manner. The THERMINATOR projects will address the following major challenges:
1) To devise innovative thermal models usable at different levels of abstraction, and to interface/integrate them into existing simulation and design frameworks. 2) To develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest.
3) To enhance existing EDA solutions by means of thermal-aware add-on tools that will enable designers to address temperature issues during their daily work and with their usual design flows.


Start date: 2010-01-01
End date: 2012-12-31

Duration: 36 months

Project Reference: 248603

Project cost: 11.02 million euro
Project Funding: 6.41 million euro

Subprogramme Area: ICT-2009.3.2 Design of semiconductor components and electronic based miniaturised systems
Contract type: Collaborative project (generic)



Coordinatore: STMICROELECTRONICS SRL - Contact person: Salvatore RINAUDO (Mr)

Altri Partecipanti

  • NXP SEMICONDUCTORS AUSTRIA GMBH - AUSTRIA
  • GRADIENT DESIGN AUTOMATION, INC. - GDA - UNITED STATES
  • NXP SEMICONDUCTORS NETHERLANDS BV - NETHERLANDS
  • SYNOPSYS SWITZERLAND LLC - SWITZERLAND
  • SYNOPSYS ARMENIA CJSC - ARMENIA
  • POLITECNICO DI TORINO - ITALY
  • ALMA MATER STUDIORUM-UNIVERSITA DI BOLOGNA - ITALY
  • INFINEON TECHNOLOGIES AG - GERMANY
  • MUNEDA GMBH - GERMANY
  • NXP SEMICONDUCTORS GA GMBH - GERMANY
  • CHIPVISION DESIGN SYSTEMS AG - GERMANY
  • COMMISSARIAT A L' ENERGIE ATOMIQUE - FRANCE
  • OFFIS E.V. - GERMANY
  • FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V - GERMANY
  • CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT - SWITZERLAND
  • BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM - HUNGARY
  • INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW - BELGIUM
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Quadro di finanziamento
  • 7FP-ICT : TECNOLOGIE DELL’INFORMAZIONE E DELLA COMUNICAZIONE: priorità tematica 3 nell'ambito del programma specifico “Cooperazione” recante attuazione del Settimo programma quadro (2007-2013) di attività comunitarie di ricerca, sviluppo tecnologico e dimostrazione
Area di interesse
  • Unione Europea